| 发明名称 |
THERMALLY INSULATIVE AND ELECTRICALLY CONDUCTIVE INTERCONNECT AND PROCESS FOR MAKING SAME |
| 摘要 |
<p>A pyroelectric focal plane array useful for thermal imaging applications comprises a detector (10), comprises a reticulated and aluminized pyroelectric chip (12) interfaced with a signal processor chip (14) by thermally insulating bumps (30) coated with a thin conductive layer (38) to form a plurality of thermally insulative and electronically conductive interconnections (16) between detector chips (12) and processor chip (14).</p> |
| 申请公布号 |
EP0279814(B1) |
申请公布日期 |
1993.04.14 |
| 申请号 |
EP19870903592 |
申请日期 |
1987.05.12 |
| 申请人 |
HUGHES AIRCRAFT COMPANY |
发明人 |
SHAHAM, YIFAL, J.;PINES, MICHAEL, Y.;KODA, N., JOHN;MURPHY, DANIEL, F. |
| 分类号 |
H01L23/52;G01J5/34;H01L21/3205;H01L21/60;H01L25/16;H01L27/16;H01L37/00;H01L37/02 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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