发明名称 |
Electrical packaging structure and liquid crystal display device having the same. |
摘要 |
<p>An electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate. <IMAGE></p> |
申请公布号 |
EP0536739(A2) |
申请公布日期 |
1993.04.14 |
申请号 |
EP19920117180 |
申请日期 |
1992.10.08 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
TAKAHASHI, MASANORI |
分类号 |
G02F1/1345;G02F1/13;H01L23/14;H01L23/538;H01L25/065 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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