| 摘要 |
A linear, direct-drive microelectronic bonding apparatus (10) provides a bondhead mounting plate (20), a stationary magnetic circuit (21), a moving coil (22), a primary wire clamp housing (23), a transducer mount (24), and a high frequency ultrasonic transducer (25) (above 100 kHz), and a capillary (26). Bondhead assembly (16) is configured to present a collective axial wire path bore (27) along which wire (12) is fed to bond site (28) for forming microelectronic bond interconnections at bond site (28). In accordance with the invention, collective wire path bore (27) provides a protected method of feeding wire (12) to bonding site (28), while magnetic circuit (21) and moving coil (22) provide actuation in a substantially linear downward direction towards the bonding site. In contradistinction, prior art bonding strokes, rather than being substantially linear, are arc-like due to the capillary and transducer being perpendicular to one another. In the present invention, transducer (25) and capillary (26) are substantially axially aligned. The substantially vertical downward bonding stroke allows bondhead assembly (16) to be used for "deep access" packages and other hard-to-reach sizes, shapes and designs of packages. In addition, ultrasonic transducer (25) has a reduced mass in comparison to the prior art which, in conjunction with the high frequency ultrasonic energy provides a low amplitude oscillation weld with greater precision and positioning.
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