发明名称 METHOD AND EQUIPMENT FOR MANUFACTURE OF ELECTRONIC PARTS
摘要 PURPOSE:To weld an anode lead to the vicinity of a lead planting surface, by making the spouting surface of a dispenser approach the lead planting surface so as to be in parallel to said surface, and spreading sol resin while smoothing it. CONSTITUTION:A dispenser 14 is so inclined that the spouting surface 14a becomes parallel to a lead planting surface 1a. The spouting surface 14a is made to approach the lead planting surface 1a, so as to form a gap equivalent to a sheet of paper. The dispenser 14 is progressed in the length direction of a metal holder. Since the gap between the spouting surface 14a and the lead planting surface 1a is equivalent to only one sheet of paper, sol resin 10a is thinnly spread on the lead planting surface 1a, from the dispenser 14. Hence an anode lead can be welded to an inner lead, so as to be adjacent to the lead planting surface, and therefore resin for covering the welded part becomes small.
申请公布号 JPH0590106(A) 申请公布日期 1993.04.09
申请号 JP19910250086 申请日期 1991.09.30
申请人 NEC KANSAI LTD 发明人 ARAI SHINJI
分类号 B05C5/00;B05D1/26;B05D7/00;H01C17/02;H01C17/28;H01G9/012;H01G13/00 主分类号 B05C5/00
代理机构 代理人
主权项
地址