| 摘要 |
<p>PURPOSE:To prevent mixture of foam in a semiconductor wafer when the wafers are adhered to each other by gradually bringing polished surfaces of the two wafers into contact with each other from the centers to the peripheries by pressing means, etc. CONSTITUTION:A semiconductor wafer 1 is held at its periphery 1b by periphery holding means 4, pressed at its center 1a by driving pressing means 3, and deflected in a curved surface state. The means 3 is driven toward a semiconductor wafer 2 and the center 1 is brought into contact with the semiconductor 2. Then, the means 3 is driven in a direction of an arrow B, the own weight of a jig 8 of an upper side is simultaneously applied to move the wafer 2 in a direction of an arrow C. Then, the radius of the curved surface is gradually increased, and its periphery 1b is held by periphery holding means 4 until it is returned to an initially flat state, and hence it is gradually adhered from the center 1a to the periphery 1b, and mixture of foams in the wafer can effectively be prevented.</p> |
