| 摘要 |
<p>PURPOSE:To provide a conductive adhesive which causes no warpage in a bonded body when a semiconductor chip is bonded on a lead frame via a conductive adhesive layer, as well as the bonded body free of warpage using the conductive adhesive. CONSTITUTION:A conductive adhesive contains silver particles and spherical particles and spherical silica 4 spherical diameter of which is controlled in a filler part, the spherical diameter of the spherical silica 4 being designed to be larger than that of the silver particles. In a bonded body such that a semiconductor chip 1 is bonded to a lead frame 3 by the conductive adhesive, the spherical silica 4 in the conductive adhesive 2 are oriented in one layer, and the film thickness of the conductive adhesive 2 is controlled to a predetermined thickness by the spherical diameter of the spherical silica 4. Therefore, the consumption of the conductive adhesive can be reduced by adjusting the film thickness to the minimum resisting warpage, as well as causing no warpage in the bonded body.</p> |
