| 摘要 |
PURPOSE:To produce the multilayer wiring board through simplified process without using any resist by forming a thin polyimid film on a board, applying a promoter thereon and forming an active area selectively through UV radiation from upper part of the mask. CONSTITUTION:The surface of board 11 is covered with an insulation film 15 of polyimide and further a photopromoter 12a is applied thereon. Next the wiring patterns on the first layer formed in a mask 13 are exposed (UV irradiation) to from active areas selectively on the photopromoter 12a. Furthermore, electroless Cu plating 14 is applied thereon to form Cu plating on only inactive areas. Then, after UV sensive polyimide 18a is applied and prebaked, the pattern of contact hole in a mask 16 exposed from the upper thereon in order to from a contact hole 19. The multilayered wiring board can be produced through repeating these steps without using any resist. |
