| 摘要 |
PURPOSE:To employ interlayer wiring an a printed wiring board without using a through hole. CONSTITUTION:When manufacturing a printed wiring board shown in Figure 1 by single plate pressing method, a metal projecting part 401 and a solder 403 are provided in sequence at electric connections of one circuit pattern 34, for example terminal part of a wiring 32, so as to form a solder terminal A consisting of the projecting part 401 and the solder 403. In addition, a metal projecting part 402 and the solder 403 are provided in sequence at electric connections of the other circuit pattern 36, for example a terminal part of a wiring 342, so as to farm a solder terminal B consisting of the projecting part 402 and the solder 403. Then a prepreg 38 is pressed to be held between the circuit patterns 34 and 36 so as to transfer them onto the prepreg 38. At this time, the prepreg 38 is pressed until the solder terminals A and B contact each other by using the prepreg 38 containing no glass cloth. Then, the solder 403 is melted and then cooled so as to connect the solder terminals A and B. As a result, the wirings 342 and 362 are electrically connected by way of an interlayer wiring 40 consisting of solder terminals A and B. |
