| 摘要 |
PURPOSE:To securely and simply identify each inner lead and detect its position in a lead frame made of a thin metal plate at the time of wire-bonding between a semiconductor chip mounted on the lead frame and an inner lead in each lead terminal. CONSTITUTION:Inner leads 6a in respective lead terminals 6 are formed in different shapes with respect to at least adjacent inner leads 6a of the respective inner leads 6a by providing either or both of a protrusion 8 and a recess 9 on a middle side or providing a bent part 10 in the middle. |
