| 摘要 |
PURPOSE:To prevent deformation of a tip of an inner lead by making every other inner lead short in the vicinity of a semiconductor element mounting part and by connecting it to a semiconductor chip via a conductor pattern formed on an insulating film adhered on the inner lead. CONSTITUTION:A semiconductor element mounting part 2 is equipped with a film part R2 comprising a semiconductor chip 5 and a polyimide film 11. A plurality of inner leads 1L,1S extend radially with their tips made long and short alternately. A gold pattern 1P is provided corresponding to the inner leads 1L, 1S. An end of the gold pattern 1P is connected to the inner leads 1L, 1S of a lead frame body R1 via a bonding wire 6a, while the other end is electrically connected to the semiconductor chip 5. At the time of wire- bonding, since bonding positions of the lead frame is alternate, contact between wires can be prevented. |
