COOLING MODULE OF ELECTRONIC COMPONENT,申请号JP19910251338-传众专利搜索

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发明名称	COOLING MODULE OF ELECTRONIC COMPONENT
摘要
申请公布号	JPH0590455(A)	申请公布日期	1993.04.09
申请号	JP19910251338	申请日期	1991.09.30
申请人	NEC CORP	发明人	HAGIWARA HIDEO
分类号	H01L23/36	主分类号	H01L23/36
代理机构		代理人
主权项
地址

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