| 摘要 |
PURPOSE:To provide a light emitting device which lightens the influence of the stress that the light emitting element receives from a mold and has improved sealing property. CONSTITUTION:A light emitting element 1 is mounted directly on a lead part (anode), and also it is bonded to a lead part (cathode) 4 through a boding wire 5, and the circumference of the light emitting element 1 is molded with epoxy resin 8 low in glass transition temperature, and the vicinity of the section where the leads 3 and 4 are exposed to the outside of the mold is molded with epoxy resin 9 high in glass transition temperature. And by putting it in such structure, the stress action on the light emitting element 1 is absorbed, and in the vicinity of the section where the leads 3 and 4 are exposed to outside, air sealing property is improved. |
