| 摘要 |
<p>PURPOSE: To make it possible to easily decrease the delay and distortion arising from a package by forming the package which has a function to separate a signal connection function from a power source supply function and gives a high-speed signal of a high current level. CONSTITUTION: This package is provided with a substrate 1 having plural integrated circuit chips 2 on at least one main surface, a signal input/output junction 3 to an integrated circuit chip 2 disposed at the edge of this substrate 1 and a conductive power source panel 5 which is separated from the signal input/ output junction 3 and is so connected on the substrate 1 as to be made removal therefrom along the surface of the substrate 1 and feeds electric power to the substrate 1. Namely, a power source connector 4 and the power source panel 5 are disposed on the lower side of the substrate 1 and the ceramic substrate 1 is removably connected to the power source panel 5 by the power source connector 4 and is, therefore, removable and mountable from a use part. Then, the supply of the electric power to logic circuits and the supply of the currents of the high level necessary for decreasing the delay and distortion by the package are made possible.</p> |
