RESIN MOLDING METHOD OF SEMICONDUCTOR

摘要

PURPOSE:To provide a resin molding method of a semiconductor which enables improvement of quality to a molding by a non-injection method in a formation method of a semiconductor element such as an IC and an LSI. CONSTITUTION:After an upper package part 5 and a lower package part 6 are formed by pressurizing and molding at a temperature which does not attain a molding temperature respectively by an upper package mold 1 and a lower package mold 2, a semiconductor element 10 is held therebetween without releasing from a die and molding is carried out at a molding temperature thereafter. Thereby, utilization of resin by gate runnerless can be improved, a thin and large area package can be formed, and wire falling and void can be prevented.