| 摘要 |
PURPOSE:To provide a chip taking-out apparatus which can decrease the cost of a product and can select the chip by a map method readily. CONSTITUTION:A chip 17a is selectively picked up from a wafer 17, which is mounted on a pressure sensitive adhesive sheet 18, and whose dicing is finished. The chip 17a is delivered to a chip holding device 12. In this chip taking out apparatus 11, a pushing-up needle 22 is provided in the vicinity of the chip holding device 12. A heating means 24 for heating the needle 22 is provided at the needle 22.
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