| 摘要 |
PURPOSE: To deal with dimensional variation of both cavity plate and semiconductor lead frame by providing a molding equipment using an elastic material. CONSTITUTION: Dam bars can be eliminated by employing an elastic material 19 covering the outer surface of a cavity plate 17 but not covering the clamping face 23. The elastic materials 19, 21 provide secondary seal of the cavity plate 17 with respect to the clamping face 23 as well as primary seal between the leads 16 of a lead frame to be sealed. The lead frame 10 to be sealed is set in a cavity. When a mold is closed, the clamping face 23 of the cavity plate 17 is clamped directly on the lead 16. Consequently, the elastic materials 19, 21 are deformed and arbitrary dimensional variation of a molding plate 27 or that between the leads are dealt with, thus sealing the gap between the leads 16 perfectly. |
