| 摘要 |
<p>PURPOSE:To provide a semiconductor chip joint having a structure wherein numerous semiconductor chips can be mounted in a single package by using common wire bonding technique. CONSTITUTION:On an element forming surface of a semiconductor chip 16 where an element forming surface is directed toward P, a semiconductor chip 18 with an element forming surface directing toward a Q direction is laminated, while they are electrically connected with each other via connecting pads 16S, 18S by a bump 30. At this time a bonding pad 16B provided on the element forming surface of the chip 16 is exposed. A semiconductor chip 20 with an element forming surface directing toward a P direction is laminated on a rear face of the chip 18 and jointed. Similarly, the chip 20 and a chip 22 are electrically connected with each other from one element forming surface to the other, while the chip 22 and a chip 24 are joined with each other from one rear face to the other. Also at this time, a bonding pad 20B provided on the element forming surface of the chip 20 is exposed.</p> |
