| 摘要 |
<p>PURPOSE:To enable a crack due to thermal stress on an electrical joint part being caused by a thermal expansion difference between a board of an equipment main body, etc., and a high-frequency module board. CONSTITUTION:A through hole 3 which penetrates through a high-frequency module board 1 is provided on the high-frequency module board 1 where circuit parts such as a dielectric resonator, a chip capacitor, and an IC are mounted on a dielectric board, a bush 6 which consists of an organic macromolecule where a through hole is formed is fitted into this through hole 3, a metal terminal 7 is press-fitted into the through hole, and then it is used as an electric joint edge with the board 2.</p> |
