| 摘要 |
PURPOSE:To render the manufacture of a tape carrier package simple by eliminating drawing processes, and to improve the heat dissipation characteristics of the tape carrier package by exposing a die pad sufficiently while the disconnection and short circuits resulting from the deflection of a film carrier tape arc prevented. CONSTITUTION:An IC chip 1 is disposed on a plane die pad 11 having a thermal expansion coefficient similar to that of the IC chip 1, a plane spacer 13 is interposed between the die pad 11 and a film carrier tape 3. The entire assembly is molded by a molding resin 6 so that the rear surface of the die pad 11 can be exposed. |
