发明名称 MULTILAYER CIRCUIT BOARD
摘要 <p>PURPOSE:To provide a multilayer circuit board containing via hole conductors which is free from deterioration and defective conduction of conductor resistance. CONSTITUTION:The body of the title board is a laminate of substrates consisting of glass frits containing ceramic materials and internal wirings 3 positioned between substrates are provided, and the internal wirings 3 between substrates are connected through via hole conductors 4, thus a multilayer circuit board 1 is constituted. The via hole conductors 4 are made of sintering conductive powder and an inorganic binder whose main content is a beta quartz solid solution.</p>
申请公布号 JPH0590765(A) 申请公布日期 1993.04.09
申请号 JP19910249673 申请日期 1991.09.27
申请人 KYOCERA CORP 发明人 IRUMAGAWA YUTAKA;IKUTA TAKANORI
分类号 H05K1/09;H05K1/00;H05K1/11;H05K3/40;H05K3/46 主分类号 H05K1/09
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