摘要 |
<p>PURPOSE:To provide a multilayer circuit board containing via hole conductors which is free from deterioration and defective conduction of conductor resistance. CONSTITUTION:The body of the title board is a laminate of substrates consisting of glass frits containing ceramic materials and internal wirings 3 positioned between substrates are provided, and the internal wirings 3 between substrates are connected through via hole conductors 4, thus a multilayer circuit board 1 is constituted. The via hole conductors 4 are made of sintering conductive powder and an inorganic binder whose main content is a beta quartz solid solution.</p> |