| 发明名称 |
Ceramic coated plastic package. |
| 摘要 |
<p>The invention is to a semiconductor package (10) and the method of making the package. A moisture resistant coating (12) such as a ceramic material is applied over a plastic packaged semiconductor device (10) to seal the package from moisture. <IMAGE></p> |
| 申请公布号 |
EP0535996(A1) |
申请公布日期 |
1993.04.07 |
| 申请号 |
EP19920309052 |
申请日期 |
1992.10.05 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ABBOTT, DONALD C.;FRECHETTE, RAYMOND A. |
| 分类号 |
H01L21/56;H01L23/28;H01L23/29;H01L23/31 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
