| 摘要 |
A surface acoustic wave (SAW) device package (10) for reducing insertion loss and direct RF feedthrough of the SAW device (14). The package (10) provides for extensive shielding of each of the input (32) and output (20, 23) pads. The inputs (32) and outputs (20, 23) to the SAW device (14) are separated by maintaining the inputs (32) on one surface (13) of the substrate (14) and the outputs (20, 23) on the opposite surface of the substrate (14). The SAW crystal substrate (14) including the SAW devices (15, 36, 17) is bonded (48) to the package substrate (12) and hermetically sealed via a low-temperature glass seal (35) or solder-type sealing (45, 60), for example. <IMAGE> |
