| 摘要 |
<p>An SMD-type resistor arrangement contains a foil (1), which forms resistor tracks, is arranged on a surface of a common substrate (2), consists of a resistor alloy and can be soldered to connecting points (3) which are connected to the resistor tracks and consist of solder metal, and have connecting surfaces which lie at least approximately parallel to the substrate surface by means of which the resistor arrangement can be soldered in a flat manner onto connecting conductors on a printed-circuit board. The connecting points (3) are completely covered by the substrate (2) and are fitted completely and directly onto the resistor metal layer (1). <IMAGE></p> |
