发明名称 |
MULTILAYERED PRINTED WIRING BOARD |
摘要 |
PURPOSE:To obtain a multilayered printed wiring board provided with a through-hole the wall surface of which is not damaged by the pre-processing for plating the through hole. CONSTITUTION:In this multilayered printed wiring board which is constituted by putting an internal-layer material 1 on which a conductive circuit 2 is formed between external-layer substrates 3 respectively provided with conductive circuits 4 on their surfaces, lands 5 which are connected to the conductive circuits 2 and lands 7 which are not connected to the conductive circuits 2 are formed on both surfaces of the material 1 where a through-hole 8 is formed. |
申请公布号 |
JPH0582968(A) |
申请公布日期 |
1993.04.02 |
申请号 |
JP19910239654 |
申请日期 |
1991.09.19 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
URAKUCHI YOSHINORI;OKUYAMA KATSUO |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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