| 摘要 |
<p>PURPOSE:To provide a semiconductor integrated circuit device which is capable of including a digital LSI chip and an analog chip on a single ceramic chip. CONSTITUTION:A digital LSI chip 2 and analog LSI chips 3 are mounted on a single ceramic chip board 1. A large number of pads 5 which connects a signal, a power source and a ground, are formed on the four sides of the ceramic board 1. A digital ground metal wiring layer 8, a digital power supply wiring layer 9 and an analog ground metal wiring layer 10 are formed on the ceramic board 1 between the digital LSI chip 2 and the analog LSI chips 3. Each of these metal wiring layers is provided with exclusively designed pads 11A, 11B, 12A, 12B, 13A and 13B, which form a mutual interruption removal filter which eliminates the electric interruption between the digital LSI chip and the analog LSI chips 3.</p> |
