| 摘要 |
PURPOSE:To obtain a semiconductor device of LOC structure which is smaller in thickness and excellent in electrical properties. CONSTITUTION:A TAB tape 10 is employed, grounding pads 2 and power supply pads 3 are arranged in line on a semiconductor chip 1, signal pads 4 are arranged on both the sides of them in line, grounding common leads and power supply common leads 7 are provided extending along the rows of the grounding pads 2 and the power supply pads 3, and grounding pads and power supply pads are directly and collectively connected to the common leads. |
