发明名称 MEMORY PACKAGE
摘要 <p>PURPOSE:To improve performance such as an access time by providing an integrated circuit, and a memory card where storage elements are mounted on both sides, and plural different-height connectors which connect the memory card and a substrate to the back of a substrate where the integrated circuit is mounted. CONSTITUTION:A memory card 3 which has plural storage element 4 mounted on both its surfaces is controlled by the integrated circuit 1 and a substrate 5 and memory card 3 are connected through plural kind of connectors 2 which are mounted on the substrate 5 and differ in height. Consequently, the space is effectively used to increase the package density. Further, the pattern length from the integrated circuit to the storage elements 4 becomes short, so the skew or delay of the medium is reducible. Namely, the memory card mounted with the storage elements 4 is mounted on the back of the substrate where the integrated circuit is mounted to improve the performance such as the access time and a cycle time.</p>
申请公布号 JPH0581499(A) 申请公布日期 1993.04.02
申请号 JP19910239083 申请日期 1991.09.19
申请人 NEC CORP;KOUFU NIPPON DENKI KK 发明人 KIJINO TAKESHI;ISHIKAWA HISASHI
分类号 B42D15/10;G06K19/077 主分类号 B42D15/10
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