发明名称 CONNECTING TERMINAL FOR PACKAGED SUBSTRATE
摘要 PURPOSE:To increase the reliability of soldered strength, and improve soldering workability by keeping a terminal end at an acute angle with a printed wiring board in a direction away there from. CONSTITUTION:The bent end 2b of the soldered section of a terminal 2 is made to form an angle theta of 90 degrees or less with the copper foil 1a of a printed wiring board 1. When an aspect of workability and mass-production is taken into consideration, the angle theta approximately between 10 and 45 degrees is practical, and if the angle exceeds 45 degrees, soldered strength becomes insufficient. By maintaining the angle range between 10 and 45 degrees, a solder fillet can be formed and the soldered strength of the terminal 2 becomes sufficient. Thus, the terminal 2 is soldered to the copper foil 1a only with a wedge portion formed with the bent end 2b and the exposed copper foil 1a, and the parallel section of the terminal 2 along length G does not need soldering specifically. Furthermore, the fillet 3a does not come above the height H of the terminal 2, and incomplete soldering can be prevented.
申请公布号 JPH0582191(A) 申请公布日期 1993.04.02
申请号 JP19910241012 申请日期 1991.09.20
申请人 CANON INC 发明人 TAKU MASAKAZU;MIZUMAKI MASAO;MIYAWAKI MAKOTO;HAMADA YOSHIAKI
分类号 H05K3/34 主分类号 H05K3/34
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