| 摘要 |
PURPOSE:To provide a semiconductor chip connecting device where adjacent solder bumps are surely prevented from being crashed down so as not to come into contact with each other when the semiconductor chip and the wiring pattern formed on a film substrate are connected together. CONSTITUTION:A bonding base table 1 where a semiconductor chip 4 on which a solder bump 5 is formed is placed is provided, a bonding tool 2 which pressure-welds and holds the semiconductor chip 4 and the film substrate 6 where a prescribed wiring pattern 7 has been formed between the bonding base table 1 and itself is provided above the bonding base table 1 in a vertically freely movable manner, and a stopper mechanism is provided to keep an optional gap between the bonding base table 1 and the bonding tool 2 when the semiconductor chip 4 and the film substrate 4 are pressure-welded. |
