| 摘要 |
<p>PURPOSE:To provide the manufacturing method of a laminated ceramic electronic component wherein, when ceramic green sheets are piled up and bonded, a high pressure can be exerted and the disconnection of a conductor caused via a through hole can be eliminated completely. CONSTITUTION:A through hole on a ceramic green sheet 2 is coated with a conductive paste; the face on which a conductive pattern has been printed is faced downward; a base film is stripped from a green sheet 5 which has been piled up together with the base film; after that, a conductive paste for transfer use is applied to a pin 6 which is a little thinner than the diameter of the through hole; the pin 6 is inserted into the through hole part from which the conductive paste has been removed partly when the film is stripped; the applied paste 8 is transferred to the through hole part. Said process is repeated, and sheets are piled up.</p> |
