| 摘要 |
PURPOSE:To enable a wiring pattern formed on a board to be surely protected against disconnection or deformation and to be easily connected to a semiconductor chip by a method wherein the semiconductor chip and the wiring pattern directly formed on a film board are connected together through the intermediary of low-melting metal bumps and a low-melting metal plating. CONSTITUTION:Low-melting metal bumps 9 are formed on the connection pad section of a semiconductor chip 1 by fusion welding, a wiring pattern 5 shop as required is formed directly on the surface of the film board 4 corresponding to the connection pad 2 section of the semiconductor chip 1, and a low-melting metal plating 10 is provided onto the surface of the wiring pattern concerned. As the low-melting metal bumps 9 of the semiconductor chip 1 are kept bearing against the terminal part of the wiring pattern 5 of the film board 4, the low- melting metal bumps 9 and the low-melting metal plating 10 are fused by heating, and the semiconductor chip 1 and the wiring pattern 5 of the film board 4 are connected together through the intermediary of the low-melting metal bumps 9 and the low-melting metal plating 10. |
