发明名称 MANUFACTURE OF MULTILAYERED PRINTED CIRCUIT BOARD
摘要 PURPOSE:To obtain a multilayered printed circuit board which enables high- density wiring, has flame retardancy and body permittivity, and is small in signal delay time by a method wherein an essential component of prepreg resin is a prepolymer of poly(p-hydroxystyrene) derivative. CONSTITUTION:In a multilayered printed circuit board where prepregs impregnated with resin into fiber cloths and circuit boards having circuit conductor layers are alternately piled up and adhered, an essential component of resin should be a prepolymer of poly(p-hydroxystyrene) derivative expressed by Formula [A is any of hydrogen, alkyl group, and halogen group; R is alkenoyl group of carbon number 2-4, aryl group, butanyl group, vinyl group, acryloyl group, methacryloyl group, or epoxymethacryloyl group; m is 1-4; and n is 1-100]. This structure can provide a compact multilayered printed substrate and reduce delay time of signal transmission by about 15%.
申请公布号 JPH0582928(A) 申请公布日期 1993.04.02
申请号 JP19920073701 申请日期 1992.03.30
申请人 HITACHI LTD 发明人 KATAGIRI JUNICHI;NAGAI AKIRA;TAWARA KEIKO;TAKAHASHI AKIO;WAJIMA MOTOYO;NARAHARA TOSHIKAZU;HIRAGA MAKOTO
分类号 H05K1/03;H05K3/46 主分类号 H05K1/03
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