| 摘要 |
PURPOSE:To provide a semiconductor integrated circuit device in which a reduction countermeasure of EMI (electromagnetic interference) is applied in an IC simplex. CONSTITUTION:In a semiconductor integrated circuit of a flat-type mold package, the internal side comprises a conductive plastic 1 and the external side comprises an insulating plastic 2, and an IC chip 3, a bonding wire 4, and a lead line 5 are electrically insulated to the conductive plastic 1, including the joint. A lead wire 7 for a power source ground has a continuity to the conductive plastic 1 and by maintaining a constant electric potential, shield effects appear. Thus, a reduction in EMI can be accomplished by an IC simplex. |
