| 摘要 |
PURPOSE:To provide a wiring board having a lead which has a minute lead superior in connection reliability and which can be miniaturized. CONSTITUTION:An insulating layer 12 and a conductive layer 13 are successively laminated on a metallic base substrate 11 to form a wiring layer 17, and also from a region 16 to be obtained by etching the metallic base substrate 11 and removing the periphery, a signal-leading lead 15 is led. |
