| 摘要 |
<p>PURPOSE:To make it possible to surely peel pellets, which has been separated from a semiconductor wafer, by extending an extensible ultraviolet-ray hardening-type adhesive sheet with spaces sufficiently provided between these pellets after an ultraviolet ray hardening-type adhesive layer is hardened by casting an ultraviolet ray. CONSTITUTION:Between a sheet base material 1a and an ultraviolet ray hardening-type adhesive layer 1c, an intermediate bonding layer 1b is formed. The intermediate bonding layer 1b has extensibility better than the sheet base material 1a and is not hardened even when irradiated by an ultraviolet ray that passes through this layer 1b.</p> |
