| 摘要 |
PURPOSE:To enable a solder layer to be formed uniform in thickness between a semiconductor chip and a semiconductor support substrate restraining air bubbles from being induced in the solder later. CONSTITUTION:Molten solder 5 is made to drop down at the center of a semiconductor support substrate 1 where a groove 2 is provided, and the surface of the molten solder 5 is formed by pressure with a solder expanding jig 3 provided with four protrusions 30mum in height at four points located at its end. Thereafter, a semiconductor chip 6 is welded to the upper part of the formed molten solder 5 by pressure.
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