VERFAHREN ZUM FLUSSMITTELFREIEN LOETEN.,申请号DE1989605001-传众专利搜索

发明名称	VERFAHREN ZUM FLUSSMITTELFREIEN LOETEN.
摘要	Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
申请公布号	DE68905001(D1)	申请公布日期	1993.04.01
申请号	DE1989605001	申请日期	1989.06.10
申请人	INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US	发明人	BICKFORD, HARRY R., OSSINING, N.Y. 10562, US;HORTON, RAYMOND R., DOVER PLAINS, N.Y. 12522, US;NOYAN, ISMAIL C., PEEKSHILL, N.Y. 10566, US;PALMER, MICHAEL J., WALDEN N.Y. 12586, US;ZYZO, JOHN C., WATERBURY, CT 06705, US
分类号	B23K1/012;H01L21/00;H01L21/60;H05K3/34;(IPC1-7):B23K1/012;B23K1/00	主分类号	B23K1/012
代理机构		代理人
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