发明名称 Capacitive sensor mfr. using monocrystal wafer - sawing through tri-layer arrangement of conductive plates and wafer which are bonded, glued, welded or soldered together
摘要 A monocrystalline Si, GaAs or quartz wafer (3) is insulated from two conductive plates (2,4) in a sandwich structure which is masked and etched to produce e.g. three sensors for separation by cutting in planes (6) coincident with, or parallel to, notches (15-17). The stray capacitance arises from the area of the bonding surfaces between the wafer (3) and plates (2,4). Single (15) and double (17) V-grooves, and wider troughs (16), are sawn to reduce risk of breakage. USE/ADVANTAGE - Prodn. of sensors for measurement of acceleration, slope or rotational speed. Has exactly defined stray capacitance connected in parallel with measuring capacitance. Requirements w.r.t. adjustment and precision of cutting are relaxed.
申请公布号 DE4132232(A1) 申请公布日期 1993.04.01
申请号 DE19914132232 申请日期 1991.09.27
申请人 ROBERT BOSCH GMBH, 7000 STUTTGART, DE 发明人 MAREK, JIRI, DIPL.-ING. DR.;WILLMANN, MARTIN, DIPL.-ING. DR., 7410 REUTLINGEN, DE;FINDLER, GUENTHER, DIPL.-ING., 7000 STUTTGART, DE;BAUMANN, HELMUT, DIPL.-PHYS. DR., 7413 GOMARINGEN, DE;OFFENBERG, MICHAEL, DIPL.-ING. DR., 7400 TUEBINGEN, DE
分类号 G01P15/08;G01P15/125;H01L29/84 主分类号 G01P15/08
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