Soldering device for flat modules such as PCB(s) - has two independently controllable nozzles providing two directed streams of liquid solder

摘要

A device for soldering flat circuitry, esp. p.c.b.'s with components mounted, transports the individual circuits along a track (14). A solder bath (2) under the track (14) is filled with liquid solder up to a solder level (4). First (24) and second (26) nozzles project up from the level (4) and have first (36) and second (50) mouths respectively, formed as long rectangular slits. The slits extend perpendicular to the transport direction. First (64) and second (54) pumps pump first (74) and second (7) solder streams through the respective nozzles (24,26). The nozzles (24,26) are independently controllable. The second (26) is operated after the first (24). The second nozzle (26) and mouth (50) are shaped so the second stream (70) flows against the transport direction. The first nozzle (24) and mouth (36) are shaped so the first stream (74) forms a wave from which solder flows partly in and partly against the transport direction. The mouths (36,50) are directly adjacent so the outflowing streams combine into a single wave. USE/ADVANTAGE - Esp. for SMD circuits. Enables accurate soldering. Prevents errors in shaded areas, bridges and oxidising.