Encapsulated semiconductor pressure sensor conductor and support arrangement - includes arms sloping downwards, bonded to chip base, permitting high level electrical connections

摘要

The pressure sensor has arms (5,6) which slope downwards from two opposite sides of a rectangular housing (10) for a chip (8) forming a pressure sensor. Main and auxiliary connections (3,4) are provided at the free ends of the arms. These are bonded to the semiconductor elements (8,9) so that the top element (8) is level with the open top (14) of the housing. An upper housing (13) completes the encapsulation. Conductors project inwards from the other two opposite sides of the housing and are connected by gold wires to the top element to form the electrical connections. ADVANTAGE - Suspension structure avoids breakage of electrical connections.