发明名称 |
ARRANGEMENT FOR MODIFYING ELECTRICAL PRINTED CIRCUIT BOARDS |
摘要 |
The modification of existing and assembled electrical printed circuit boards is accomplished by placing additional conductors between the lead wires (4) of the electrical components (2). These conductors are in the form of a printed conductor foil (3) which is placed on the support plate (1) of the printed circuit module. The ends of the conductors on the conductor foil (3) terminate in soldering eyelets which are soldered to the protruding lead wires (4). By this means all additional electrical connections can be made at one time and without the danger of routing errors. |
申请公布号 |
AR242330(A1) |
申请公布日期 |
1993.03.31 |
申请号 |
AR19850301148 |
申请日期 |
1985.07.31 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
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分类号 |
H05K1/00;H05K1/14;H05K3/22;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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