发明名称 ARRANGEMENT FOR MODIFYING ELECTRICAL PRINTED CIRCUIT BOARDS
摘要 The modification of existing and assembled electrical printed circuit boards is accomplished by placing additional conductors between the lead wires (4) of the electrical components (2). These conductors are in the form of a printed conductor foil (3) which is placed on the support plate (1) of the printed circuit module. The ends of the conductors on the conductor foil (3) terminate in soldering eyelets which are soldered to the protruding lead wires (4). By this means all additional electrical connections can be made at one time and without the danger of routing errors.
申请公布号 AR242330(A1) 申请公布日期 1993.03.31
申请号 AR19850301148 申请日期 1985.07.31
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人
分类号 H05K1/00;H05K1/14;H05K3/22;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K1/00
代理机构 代理人
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