Method of making fine-wire low-profile interconnections.

摘要

A method of forming fine wire interconnections between two bonding targets using a capillary bonding tool in which a ball bond is formed on the first target, the tool is raised to pay out a pre-determined length of wire shorter than the length to be used in the final interconnection, the wire is clamped and the tool moved in an arcuate path to a point short of the final position on the second target. The second bond is then started, the wire is unclamped, the tool moved to the final position on the second target, and the wire is further bonded, thereby creating an enlarged second bond. The tool may be moved while making the second bond to produce an elongated bond. The second bond may be a thermosonic bond.