| 摘要 |
A method for providing an inlay on a substrate includes providing a recess in the substrate, preheating the substrate to a temperature of approximately 150 DEG F., mixing an epoxy resin with an epoxy hardener, and placing the mixture into the recess so that the mixture hardens in the recess and the heat stored in the substrate reduces the viscosity of the mixture, to aid in the removal of bubbles.
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