发明名称 |
Modified lead frame for reducing wire wash in transfer molding of IC packages |
摘要 |
In a leadframe supporting a semiconductor device, the tiebar adjacent the mold gate is kinked, or cut and bent, to form a baffle shielding bond wires connecting the semiconductor device to the leadframe from damage by a jet of incoming molding compound. Whether kinked or cut/bent, the baffle extends out of the plane of the leadframe so as to be disposed more-or-less directly in front of the gate. |
申请公布号 |
US5197183(A) |
申请公布日期 |
1993.03.30 |
申请号 |
US19910787848 |
申请日期 |
1991.11.05 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CHIA, CHOK J.;LIM, SENG-SOOI |
分类号 |
B29C45/14;H01L21/56;H01L23/495 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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