发明名称 |
Multiple integrated circuit module which simplifies handling and testing |
摘要 |
A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).
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申请公布号 |
US5198963(A) |
申请公布日期 |
1993.03.30 |
申请号 |
US19910795440 |
申请日期 |
1991.11.21 |
申请人 |
MOTOROLA, INC. |
发明人 |
GUPTA, DEBABRATA;DRYE, JAMES E. |
分类号 |
G01R31/28;H01L21/66;H01L23/538;H01L25/065 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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