| 摘要 |
PURPOSE:To provide a semiconductor-element mounting method wherein a semiconductor element can be mounted on a board easily and with high reliability. CONSTITUTION:An interconnection-electrode pattern 26 for connecting electrode extraction use is first formed on a board 21 which has been wired; after that, a gold-plating operation is executed; the board is formed. Then, the board 21 which has been formed in this manner is placed on a facedown-type semiconductor-element mounting device; the interconnection-electrode pattern 26 on the board 21 is recognized; after that, a tool for exclusive use is pressed to bonding points on the interconnection-electrode patterns 26 on the board 21; heat is applied in a pulse manner; the interconnection-electrode pattern 26 is pressurized and plastic-deformed; protruding parts 28 are formed partly on the interconnection-electrode pattern 26. Then, the board 21 is coated with an anisotropic conductive resin, which is not indicated in the figure, as a material for connection use; the protruding parts 28 on the board 21 are overlapped with, bonded to and connected electrically to bump electrodes 25 which have been formed on a semiconductor element 22. |
