| 摘要 |
PURPOSE:To ensure complete electric connection even if electronic component lead pitch is reduced and to enable easy handling even if lead pitch is reduced by carrying out electric connection between a printed wiring board and a surface package semiconductor electronic component by a metallic wire. CONSTITUTION:Adhesive 2 is applied to a printed wiring board 1, and a surface package semiconductor electronic component 3 is mounted and fixed to the printed wiring board by the adhesive 2. A full wire 4 is connected surely to a wiring of the printed wiring board 1 and a lead of the surface package semiconductor electronic component 3 one by one by thermo-compression bonding using a wire bonder to ensure electric connection of both. A lead 5 which takes electric connection with a printed wiring board is arranged on a semiconductor electronic component package 6 and prevents lead bending caused by handling, etc. Complete electric connection is attained by ensuring connections one by one by a metallic wire by using a wire bonder. Furthermore, short-circuiting between leads is prevented by reducing a size of a lead. |
