| 摘要 |
PURPOSE:To enhance the yield of products by preventing the trouble of a short circuit which is caused by an increase in connection wires and by a narrow pitch in a semiconductor device wherein a semiconductor element and a lead frame are connected by a wire bonding operation. CONSTITUTION:A semiconductor element 2 and a lead frame 1 are connected electrically by using wires 3; after that, the surface of the wires 3 is coated with a polyimide precursor; a heat treatment is executed to it; a polyimide-resin insulating film 4 is formed. Lastly, the whole assembly is sealed with a thermoplastic resin 5. Thereby, even when the wires 3 come into contact with each other by the flow of the thermoplastic resin 5 in its sealing operation, it is possible to prevent the wires from being short-circuited electrically. |
