| 摘要 |
PURPOSE:To provide an outer-lead bonding method wherein a device which has been formed of a film carrier can be mounted well on an electrode on a board. CONSTITUTION:A characteristic part 7 is formed in a position where a thermocompression bonder 4 for a lead L on a device P is pressed; the characteristic part 7 on the device P which has been sucked to a nozzle 3 at a bonding head 2 is observed by means of a camera 8. The position of the characteristic part 7 is detected; a board 9 is observed by means of the camera; the position of an electrode 11 on the board 9 is detected; the device P is moved in the X-, Y- and theta-directions relatively to the board 9 so that the lead L on the device P can be matched to the electrode 11 on the basis of the observed result; then, the nozzle 3 is lowered; the lead L is landed on the electrode 1 the thermocompression bonder 4 installed at the bonding head 2 is pressed to the characteristic part 7; the lead L is thermally bonded to the electrode 11. |
