发明名称 PRINTED-CIRCUIT FORMING METHOD
摘要 PURPOSE: To provide a printed circuit with a selected easily solderable surface (for instance, pad, through hole and land) for helping the next connection to it of an electronic component by soldering. CONSTITUTION: In a printed circuit, having an exposed electrically conductive surface to which an electronic component can be connected by soldering, the exposed electrically conductive surface is made of copper, a coating (mainly made of a metal selected from a group composed of nickel and cobalt) on the copper and a coating (mainly made of a protective material) on the nickel or the cobalt.
申请公布号 JPH0575246(A) 申请公布日期 1993.03.26
申请号 JP19910274453 申请日期 1991.07.26
申请人 MACDERMID INC 发明人 JIYON II BENGUSUTON;GERII BII RAASON
分类号 H05K1/09;H05K3/24;H05K3/34 主分类号 H05K1/09
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